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MLX90248
Micropower & OmnipolarTM Hall Switch TM Features and Benefits
Micropower consumption ideal for batterypowered applications Omnipolar, easy to use as output switches with both North and South pole Ultra-Thin QFN package (0.43mm max) & Thin SOT23 3L (both RoHS Compliant) Very High Sensitivity Hall Sensor Chopper stabilized amplifier stage Operation down to 2.5V
Application Examples
Solid State Switch Handheld Wireless Handset Awake Switch Lid close sensor for battery-powered devices Magnet proximity sensor for reed switch replacement in low duty cycle applications
Ordering Information
Part No. MLX90248 MLX90248 Temperature Code E (-40 to 85 C C) E (-40 to 85 C C) Package Code SE (TSOT-3L) LD (UTQFN-6L)
1 Functional Diagram
2 General Description
The MLX90248 Omnipolar Hall effect sensor IC is fabricated from mixed signal CMOS technology. It incorporates advanced chopper-stabilization techniques to provide accurate and stable magnetic switch points. The circuit design provides an internally controlled clocking mechanism to cycle power to the Hall element and analog signal processing circuits. This serves to place the high current-consuming portions of the circuit into a "Sleep" mode. Periodically the device is "Awakened" by this internal logic and the magnetic flux from the Hall element is evaluated against the predefined thresholds. If the flux density is above or below the Bop/Brp thresholds then the output transistor is driven to change states accordingly. While in the "Sleep" cycle the output transistor is latched in its previous state. The design has been optimized for service in applications requiring extended operating lifetime in battery powered systems. The output transistor of the 90248 will be latched on (BOP) in the presence of a sufficiently strong South or North magnetic field facing the marked side of the package. The output will be latched off (BRP) in the absence of a magnetic field.
TM
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Data Sheet Sept/06
MLX90248
Micropower & OmnipolarTM Hall Switch TM Table of Contents
1 Functional Diagram ........................................................................................................ 1 2 General Description........................................................................................................ 1 3 Glossary of Terms .......................................................................................................... 3 4 Absolute Maximum Ratings ........................................................................................... 3 5 Pin Definitions and Descriptions................................................................................... 3 6 General Electrical Specifications .................................................................................. 4 7 Magnetic Specifications ................................................................................................. 4 8 Outputs Behaviour vs. Magnetic Pole........................................................................... 4 9 Detailed General Description ......................................................................................... 5 10 Unique Features............................................................................................................ 5 11 Performance Graphs .................................................................................................... 6
11.1 Magnetic Thresholds vs. TA .....................................................................................................................6 11.2 Magnetic Thresholds vs. VDD ...................................................................................................................6 11.3 Current Consumption vs. TA ....................................................................................................................6 11.4 Current Consumption vs. VDD ..................................................................................................................6 11.5 Consumption Period vs. TA ......................................................................................................................6 11.6 Consumption Period vs. VDD ....................................................................................................................6 11.7 Output Saturation Voltage vs. TA .............................................................................................................7 11.8 Output Switching Characteristics.............................................................................................................7
12 Application Information................................................................................................ 7 13 Standard information regarding manufacturability of Melexis products with different soldering processes........................................................................................... 8 14 ESD Precautions ........................................................................................................... 8 15 Package Information..................................................................................................... 9
15.1 SE Package (TSOT-3L)...........................................................................................................................9 15.2 LD Package (UTQFN-6L) ......................................................................................................................10
16 Disclaimer.................................................................................................................... 11
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Data Sheet Sept/06
MLX90248
Micropower & OmnipolarTM Hall Switch TM 3 Glossary of Terms
Gauss, milliTesla (mT), Units of magnetic flux density : 10 Gauss = 1mT
4 Absolute Maximum Ratings
Parameter Symbol Supply Voltage (operating) VDD Supply Current IDD Output Voltage VOUT Output Current IOUT Operating Temperature Range TA Storage Temperature Range TS ESD Sensitivity (1) Table 1: Absolute maximum ratings Value 5 5 5 5 -40 to 85 -50 to 150 5000 Units V mA V mA C C V
Note 1: Human Body Model according JESD22-A114 standard - 100pF capacitor discharged through 1.5k resistor into each pin.
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximumrated conditions for extended periods may affect device reliability.
5 Pin Definitions and Descriptions
SE Package Pin Name Function Pin (SE) VDD Power Supply 1 GND Ground 3 OUT Output (Open Drain) 2 NC Not Connected Table 2: Pin definitions and descriptions
Note : Exposed Pad on LD package is connected to ground
LD Package Pin (LD) 2 3,4 5 1,6
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Data Sheet Sept/06
MLX90248
Micropower & OmnipolarTM Hall Switch TM
6 General Electrical Specifications
DC Operating Parameters TA = 25 C, VDD = 3V (unless otherwise specified) Parameter Supply Voltage Supply Current Output Current Output Saturation Voltage Awake Period Sleep Period Symbol VDD IDD IOUT VSAT TAW TSL Test Conditions Operating Average IOUT = 1mA Operating Operating Min 2.5 Typ 3 10 Max 3.5 1 0.4 85 32 70 Units V A mA V s ms
o
Table 3: Electrical specifications
7 Magnetic Specifications
DC Operating Parameters TA = 25 C, VDD = 3V (unless otherwise specified) Parameter Symbol Min Operating Point BOP Release Point BRP +/-0.5 Hysteresis BHYST Table 4: Magnetic specifications Typ Max +/-6 Units mT mT mT
o
1
Note 2: For typical values, please refer to the performance graphs section
8 Outputs Behaviour vs. Magnetic Pole
SE Package Parameter North or South pole "Zero" magnetic pole Test conditions B > |BOP| B < |BRP| OUT (SE) Low High OUT (LD) Low High
LD Package
Table 5: Outputs behaviour vs. magnetic pole
Note : The magnetic pole is applied facing the branded side of the package
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Data Sheet Sept/06
MLX90248
Micropower & OmnipolarTM Hall Switch TM
9 Detailed General Description
The MLX90248 is originally used in mobile phone applications for open/close lid detection (slide and jackknife phone type). The goal of this detection is to switch on or off the application if the lid is opened or closed, in order to save battery power. The same operation principle can be simply applied to any other battery-powered device with a lid/cover like laptop, digital cameras and camcorders. By the use of a very high sensitivity Hall sensor, a very small and cheap magnet is enough to trigger the MLX90248, hence it can easily replace reed switch. The major benefit of using a Hall sensor is to provide "electronic" commutation, which is bounce-free, more reliable and with increased lifetime compared to usual mechanical contacts.
10 Unique Features
The MLX90248 exhibits "Omnipolar" magnetic characteristics. It means the device reacts to both North and South magnetic pole. The purpose is to detect the presence of any magnetic field applied on the device. This mode of operation simplifies customer production processes by avoiding the need to detect the Hall sensor pole active on the magnet used in the application. Taking the example of a generic Hall sensor "south pole active", during its production, the customer must detect the south pole of the application magnet and face it to the device to enable the output to be turned on and off. Without any magnet pole detection system, the incorrect magnetic pole (north in this example) could be faced to the device which would fail the application. Therefore, the "Omnipolar" magnetic behaviour helps customers by removing the need of magnet pole detection system during production phase. The "Micropower" feature makes the MLX90248 especially suitable for battery-powered device as it combines low voltage operation and low current consumption. By using a sleep/awake strategy managed internally, the power consumption is drastically reduced. To make a comparison, the MLX90248 consumes 100 times less power than the generic low voltage Melexis Hall sensor US3881. As well as Thin SOT package, the MLX90248 is now delivered in an ultra thin UTQFN package. This new 2 leadless package only requires 3mm PCB surface and is 0.43mm maximum thick, which is particularly important in design where space-saving and miniaturisation are the critical factors.
3901090248 Rev 012
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Data Sheet Sept/06
MLX90248
Micropower & OmnipolarTM Hall Switch TM
11 Performance Graphs
11.1 Magnetic Thresholds vs. TA
6
11.2 Magnetic Thresholds vs. VDD
6
4 Magnetic flux density (mT) Magnetic flux density (mT)
4
2 Bops 0 Bopn Brps Brpn
2 Bops 0 Bopn Brps Brpn
-2
-2
-4
-4
-6 -40 -20 0 20 Ta ( C) 40 60 80
-6 2.5 3 VDD (Volts) 3.5
11.3 Current Consumption vs. TA
12
11.4 Current Consumption vs. VDD
12
10
10
Current Consumption
8
Current Consumption
8
6 Iawake(mA) 4 Isleep(uA) Iaverage(uA) 2
6 Iawake(mA) 4 Isleep(uA) Iaverage(mA) 2
0 -40 -20 0 20 Ta ( C) 40 60 80
0 2.5 3 VDD (Volts) 3.5
11.5 Consumption Period vs. TA
100
11.6 Consumption Period vs. VDD
100
80 Consumption Period Consumption Period
80
Tawake(us) 60 Tsleep(ms)
60
Tawake(us) Tsleep(ms)
40
40
20
20
0 -40 -20 0 20 Ta ( C) 40 60 80
0 2.5 3 VDD (Volts) 3.5
3901090248 Rev 012
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Data Sheet Sept/06
MLX90248
Micropower & OmnipolarTM Hall Switch TM
11.7 Output Saturation Voltage vs. TA
50 Vout (Vdd=2.5V) Vout (Vdd=3V) Output Saturation Voltage (mV) 40 Vout (Vdd=3.5V)
11.8 Output Switching Characteristics
30
20
10
0 -40 -20 0 20 Ta ( C) 40 60 80
12 Application Information
VDD OUT 2.5~3.5V 10nF GND MLX90248
100k
Output signal
100pF
Typical application
3901090248 Rev 012
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Data Sheet Sept/06
MLX90248
Micropower & OmnipolarTM Hall Switch TM
13 Standard information regarding manufacturability of Melexis products with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD's (Surface Mount Devices) * IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2)
*
Wave Soldering SMD's (Surface Mount Devices) and THD's (Through Hole Devices) * * EN60749-20 Resistance of plastic- encapsulated SMD's to combined effect of moisture and soldering heat EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD's (Through Hole Devices) * EN60749-15 Resistance to soldering temperature for through-hole mounted devices
Solderability SMD's (Surface Mount Devices) and THD's (Through Hole Devices) * EIA/JEDEC JESD22-B102 and EN60749-21 Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD's is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx
14 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
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Data Sheet Sept/06
MLX90248
Micropower & OmnipolarTM Hall Switch TM
15 Package Information
15.1 SE Package (TSOT-3L)
2.75 BSC 1.60 BSC
see note 2
1.10 MAX
SEATING PLANE
0.88 +0.02 - 0.03 0.075 +0.025 - 0.050
Notes: 1. All dimensions are in millimeters 2. Outermost plastic extreme width does not include mold flash or protrusions. Mold flash and protrusions shall not exceed 0.15mm per side. 3. Outermost plastic extreme length does not include mold flash or protrusions. Mold flash and protrusions shall not exceed 0.25mm per side. 4. The lead width dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.07mm total in excess of the lead width dimension at maximum material condition. 5. Dimension is the length of terminal for soldering to a substrate.
0.50 BSC
6. Dimension on SECTION B-B' are apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. 7. Formed lead shall be planar with respect to one another with 0.076mm at seating plane.
TOP VIEW SIDE VIEW
12 REF. TYP.
BASE METAL WITH PLATING
Marking: Top side : 248D - Name of the Device (MLX90248) Bottom side : xyww x = last digit of lot number y = last digit of year ww = week
0.10 R. MIN.
~ 0.10 R. MIN.
SEATING PLANE
B' B 0.35 +0.05 - 0.10 0.30 0.45
4+/-4
0.40+/-0.10
see note 5
0.575 REF.
SECTION B-B'
see note 6
END VIEW
Hall plate location
1.43+/-0.05
Notes: 1. All dimensions are in millimeters
0.28 TYP
END VIEW
Package line
TOP VIEW
3901090248 Rev 012
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Data Sheet Sept/06
MLX90248
Micropower & OmnipolarTM Hall Switch TM
15.2 LD Package (UTQFN-6L)
3901090248 Rev 012
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Data Sheet Sept/06
MLX90248
Micropower & OmnipolarTM Hall Switch TM
16 Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical lifesupport or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis' rendering of technical or other services. (c) 2005 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at www.melexis.com Or for additional information contact Melexis Direct: Europe, Africa, Asia:
Phone: +32 1367 0495 E-mail: sales_europe@melexis.com
America:
Phone: +1 603 223 2362 E-mail: sales_usa@melexis.com
ISO/TS 16949 and ISO14001 Certified
3901090248 Rev 012
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Data Sheet Sept/06

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